Smaller PCBs, including rigid-flex circuits, call for die attach using one of three methodologies, depending on the application Technologies that for years were the sole domain of semiconductor ...
QPT just filed a patent for the “qAttach” process, a novel way to attach dies to heat spreaders or substrates (typically aluminum nitride (AlN)) that significantly reduces thermal resistance. The new ...
DUBLIN--(BUSINESS WIRE)--The "Die Attach Equipment - Global Market Outlook (2018-2027)" report has been added to ResearchAndMarkets.com's offering. The Global Die Attach Equipment market is expected ...
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