Vinci today announced the availability of its second core physics capability: thermo-mechanical simulation that predicts “warpage” in hardware designs: how they bend, twist, and deform under ...

Cambashi reviews the mechanical CAE and simulation market, highlighting AI innovation, major acquisitions, and growth ...

For five years, a single idea dominated Chinmay Shrivastava's thoughts: humans didn't have enough hours in the day to build the designs of the future. An avid lover of science fiction, Chinmay ...

“Addressing complex engineering challenges such as developing products that are more powerful, yet greener, lighter yet stronger requires a fully-integrated CAE solution,” said Jean-Claude Ercolanelli ...

Hardware-in-the-loop (HiL) refers to testing a component while embedding it in one or more of its likely environments. These environments are represented virtually by computer models. The tested ...

Have you ever wondered how to eliminate internal delamination inside your semiconductor package, or how to reduce warpage of your large ball-grid array (BGA) package to eliminate non-wets during board ...

Vinci’s physics AI foundation model delivers deterministic, solver-accurate warpage analysis across extreme scales—already in production use at leading hardware companies Building on its ...