To coincide with this year's Reith Lectures, entitled the Triumph of Technology, You and Yours asked what has been the most significant technological innovation since 1800. From the hundreds of ...

Taiwan broke ground on Phase II of the Chiayi Science Park, where TSMC will add advanced packaging fabs to a site already running two in mass production.

Taiwan Semiconductor Manufacturing Co. plans to expand its chip-making capacity with two additional facilities to help meet demand related to artificial intelligence. The government for the southern ...

The second phase of Chiayi Science Park has officially broken ground on a site of about 90 hectares, with TSMC leading the development of an industrial cluster centered on advanced packaging. The ...

Taiwan Semiconductor Manufacturing Co (TSMC) will add two advanced chip ​packaging plants in the Chiayi Science Park, ‌the ...

How AI Could Cut Semiconductor Package Design Cycles from Months to Days This paper explores how AI-powered semiconductor package design tools can accelerate deve ...