The tool delivers the performance of standalone single-wafer cleaning tools on low-to-medium temperature sulfuric peroxide ...

Japanese chipmaker Rapidus will try to lure customers away from TSMC not only by offering a different kind of service, but also by offering its manufacturing services at lower prices, chief executive ...

KLA's AI-driven demand, process-control leadership and advanced packaging exposure may help it outgrow the WFE market through ...

Lam Research gains attention as semiconductor equipment demand, stronger earnings, and chip manufacturing trends support ...

ClassOne Technology, a leading global provider of advanced electroplating and wet processing tools for microelectronics manufacturing, today announced record follow-on orders from Applied ...

The AI fab CapEx supercycle is shifting from thesis to invoice, and the picks-and-shovels names sit directly under that spending fire hose.

Japanese chipmaker Rapidus discloses one more aspect of its strategy: to offer lower quotes than TSMC.

Soaring AI/HPC device demand is driving leading-edge foundries to support the transition from wafers to panels to accommodate increasingly larger device sizes. But to ensure that panels with multiple ...

The EuroCZFactory project aims to bolster Europe’s capabilities in silicon ingot and wafer production. Image generated by AI. A new EU-funded project has launched, aimed at strengthening Europe’s ...

Years of continued U.S. and European export restrictions were designed to slow China’s growth in semiconductor manufacturing.

As high-end chipmakers build new production lines to meet soaring demand, they'll need more of Lam Research's equipment.

Innovations spanning DRAM and advanced packaging enable the 3D architectures behind cutting-edge AI chipsA new epitaxy system optimized for DRAM ...